型号:

BSP19,115

RoHS:无铅 / 符合
制造商:NXP Semiconductors描述:TRANS NPN 350V 50MA SOT223
详细参数
数值
产品分类 分离式半导体产品 >> 晶体管(BJT) - 单路
BSP19,115 PDF
特色产品 NXP - I2C Interface
标准包装 1,000
系列 -
晶体管类型 NPN
电流 - 集电极 (Ic)(最大) 100mA
电压 - 集电极发射极击穿(最大) 350V
Ib、Ic条件下的Vce饱和度(最大) 500mV @ 4mA,50mA
电流 - 集电极截止(最大) -
在某 Ic、Vce 时的最小直流电流增益 (hFE) 40 @ 20mA,10V
功率 - 最大 1.2W
频率 - 转换 70MHz
安装类型 表面贴装
封装/外壳 TO-261-4,TO-261AA
供应商设备封装 SC-73
包装 带卷 (TR)
其它名称 568-6958-2
933983400115
BSP19 T/R
BSP19 T/R-ND
BSP19,115-ND
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